2.5D and 3D packaging became the industry dark horse.
Tesla’s investment plan in India is "bubble"
According to media reports on Thursday, Tesla’s original planned $ 3 billion of investment in India may have stagnated.It is understood that in April of this year, Musk canceled the original plan to visit India on the grounds that the company faced urgent issues, including meeting with Prime Minister Modi.
People familiar with the matter said that the Indian government has hoped that domestic auto manufacturers such as Tata Automobile and Ma Hengda will increase electric vehicle production.They added that if Musk decided to re -participate, Tesla will still be welcomed and can use new import tax policies.
According to data from Bloombergnef, India’s electric vehicle market is in its infancy, and in 2023, battery vehicles account for only 1.3%of the total market.Due to the high early costs and the lack of charging stations, consumers have hinders consumers’ choice of electric vehicles.
The stranding of Tesla’s investment plan is undoubtedly a lofty development for the development of the Indian electric vehicle market.Although the Indian government has introduced a series of incentive policies, the market cultivation of electric vehicles will not be completed overnight. The development of the Indian electric vehicle industry in the future may depend on the efforts of local enterprises and the government’s continuous support.
Semiconductor giants are developing 3.3D advanced packaging technology
On July 4th, Samsung Electronics is responsible for the semi -conductive business equipment solution (DS) department to reorganize the same day, set up a new HBM R & D team to focus on developing HBM3, HBM3E, and new generation HBM4 technology.In addition, Samsung Electronics has reorganized the advanced packaging (AVP) team and equipment technical experiments to enhance the overall technical competitiveness.
It is also reported that Samsung Electronics Advanced Packaging (AVP) department is leading the development of "Semiconductor 3.3D Advanced Packaging Technology", which is applied to AI semiconductor chips and has mass production in the second quarter of 2026.Samsung expects that after the commercialization of new technology, the cost can save 22%; Samsung Electronics will also introduce panel grade (PLP) packaging in 3.3D packaging technology to further improve the efficiency of packaging production.
Guotai Junan Securities Electronics team believes that, driven by industries such as artificial intelligence, 5G communication and high -performance computing, 2.5D and 3D packaging will become the industry dark horse. It is expected that by 2028, it will become the second largest formal form.Surat Stock
Advanced packaging demand continues to explodeMumbai Wealth Management
With the help of artificial intelligence boom, the market value of the global chip foundry giant TSMC is approaching $ 1 trillion.On July 3, TSMC rose nearly 4%, and the stock price was approaching a record high, and the cumulative increase of more than 70%during the year.
With the increase of the demand for AI chips and the slowdown of Moore’s law, simply relying on advanced processes to increase the cost -effectiveness of computing power, and advanced packaging technology plays a key role in improving chip performance.
In the post -Moore era, chip manufacturers have transformed from "roll -up" to "volume packaging", from "how to make chips smaller" to "how to seal the chip smaller", and the needs of advanced packaging will continue to explode.
At present, one of the main forms of packaging of AI and high -performance computing chip manufacturers is TSMC COWOS technology.Research and Economic Research Institutions Research Institute pointed out that AI and HPC chips have a large demand for advanced packaging technology. Among them, TSMC’s 2.5D advanced packaging COWOS technology is currently adopted by AI chips.
According to YOLE data, the global market size was encapsulated by 47.5 billion US dollars in 2026, and the average annual growth rate of the compound annual growth rate of about 7.7%from 2020-2026.According to OMDIA forecasts, with the penetration of emerging application fields such as 5G, AI, and HPC, the global Chiclet market size is expected to reach 57 billion US dollars in 2035. The average annual growth rate of compound annual growth in 2018-2035 was 30.16%.
Domestic sealing and testing factories follow the layout, and the secrets of high growth concept stocks revealed
With the continuous update of sealing and testing technology, domestic manufacturers have made important layouts in 2.5D and 3D advanced packaging, and have made a certain breakthrough.CITIC Securities Research Report stated that it is recommended to pay attention to the opportunity to accelerate the independent acceleration of domestic semiconductor advanced manufacturing, advanced packaging, equipment/components and AI chips.
Changdian Technology is one of the leading domestic seals and testing companies, and has a significant layout in the field of advanced packaging.In 2023, the company launched the XDFOI Chiplet high -density multi -dimensional heterogeneous integrated series process has entered the stable output stage as planned. It uses collaborative design concepts to realize the integration of chip finished product integration and testing, covering 2D, 2.5D, and 3D integrated technologies.
Tongfu Microelectronics has made important progress in advanced packaging technologies such as Chiclet, and has the ability to mass production.
As the leader of the semiconductor packaging industry, Huatian Technology has mastered the packaging process of FC, WB, FC+WB, FO, ESIFO, 3DESinc.
According to the Securities Times · Data Bao statistics, there are more than 100 advanced concept stocks in the A-share market, of which the Shennan Circuit, Cambrian -U, and Shengyi Technology has increased by 49.47%, 43.35%, 13.42 respectively, respectively%.
Judging from the maximum increase since the year, 23 shares such as Lehman Optoelectronics, Gas Technology, Baiwei Storage, and Eisen Co., Ltd. increased by more than 100%.From the perspective of turnover, the average daily turnover of Tongfu Microelectronics, Cambrian -U, Baiwei Storage, and Changdian Technology exceeded 1 billion yuan during the year.
From the perspective of institutional attention, Sino -Micro Corporation, Tuojing Technology, Changdian Technology, Dinglong Co., Ltd., and Xinye Micro -installed 5 shares have 20 or more institutions rated.There are more than 10 institutions such as Wentai Technology and other 15 shares.
According to statistics from data treasure, among the 5 and above institutions rated stocks, 18 institutions unanimously predict that the net profit growth rate of net profit this two years will exceed 30%.The speed average is expected to exceed 100%.
Disclaimer: All information content of data treasure does not constitute investment suggestions, the stock market has risks, and investment needs to be cautious.
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